I-Tile Adhesive

Ipolymer esekwe, icandelo elinye elomileyo elingumgubo ocoarse iputty enamandla amakhulu okubambisa kunye nokusebenza okugqwesileyo. Ihambelana nokusingqongileyo kwaye ayinazingcolisi, iyenza ilungele idyasi yokuqala neyesibini ye-putty leveling.

● Ukumelana kakuhle namaqondo aphantsi, iqhwa, nokuguquguquka kweqondo lobushushu, yaye uzinzo olubalaseleyo.

● Ukudibanisa okuqinileyo kwe-interlayer kunye namandla aphezulu okudibanisa, akuthandeki kwi-detachment.

● Ixesha lokumisa kancinci, livumela ixesha elide lokusebenza kunye nokusebenza okugqwesileyo.

● Amandla omatshini aphezulu emva kokusabela nge-putty, kunye nokusebenza okugqwesileyo kwe-anti-sag.

● Kulula kwaye kulula ukuyifaka, kungekho mfuneko yokurhangqa umphezulu wethayile.

IiMfuneko zeMozulu: Kuthintele ukusetyenziswa kwiimeko zemozulu ezigqithisileyo njengeqabaka, iqhwa, imvula, okanye ikhephu. Ubushushu be-substrate kufuneka bube phakathi kwe-5-35 ° C, kwaye ukufuma komoya kufuneka kube ngaphantsi kwe-85%.

Ulungelelwaniso lokuxuba: I-adhesive tile kufuneka ixutywe ngokucokisekileyo kwaye isetyenziswe ngokuthe ngqo.

Imiyalelo yesicelo: Okokuqala, jonga i-substrate endala yodonga kwaye uyiphathe ngokwendlela yeendonga ezintsha.
Susa naziphi na iithayile ezivulekileyo, ezaphukileyo, okanye eziqhekekileyo, kwaye ugcwalise kwaye ugudise nge-putty yodonga lwangaphandle.
Ukuba kukho uthuli oludadayo, amabala, ukungunda, okanye ubulembu, coca umphezulu ngompu wamanzi woxinzelelo oluphezulu.
Emva konyango, faka idyasi ye-FAC ye-Tile Bonding Adhesive ngerola ngaphambi kokuba uyigudise ngedyasi epheleleyo ye-putty erhabaxa phambi kokuba yome.

Imiyalelo yokuGcina: Imveliso isekelwe emanzini kwaye ayinayo ingozi yokuthutha. Gcina kwindawo epholileyo nengena umoya kumaqondo obushushu aphakathi kwe-5-35°C, ukuthintela ukuchanabeka kwilanga okanye imvula. Ixesha lokugcina elivaliweyo ngunyaka omnye."